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Advantages of NanoMetallix Technology

The merger of few advanced deep-tech processes creates an outstanding advantages:

Very high-speed process

enables PCB production for mainstream markets.

PCB Characteristics

comparable to current FR4 based boards enables broad industry acceptance

Low CAPEX and low OPEX

enables rapid industry adoption.

NanoMetallix Main Characteristics:

Conductive Traces:

Copper-based | Present: 70% Cu + 30% Ag | Future: >98% Cu

Dielectric Layer:

Hlass-filled epoxy / polyamide / ceramic / other

Conductivity:

~60% of bulk copper

Continue to:

FINAL PRODUCED PCB
(photo from Benny)

The Final Result of NanoMetallix Device is high-quality PCB - produced with material specifications that are aiming to outperform conventional production PCB - with significant gap regarding environmentally-friendly criteria.

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